REGISTER AGENDA 10:00 am Welcome - Professor GP Li, director Calit2/CalPlug/ITAC 10:10 am From Barriers to Breakthroughs: Social Science Insights for Accelerating Heat Pump Adoption in California - Sarah Outcault, Market Transformation Research Director at the UC Davis Energy and Efficiency Institute and Western Cooling Efficiency Center 10:40 am CalPlug and SMART IAC Updates Arnold Wang – CalPlug Katie Gladych – Energy Plug Load updates/CA EE Policy Chelsea Choudhary – SMART ITAC Noon Lunch Break 12:45 pm Realizing the Potential of Clean Hydrogen - Jeff Reed, Renewable Fuels and Energy Storage Chief Scientist at UC Irvine Advanced Power and Energy Program 1:15 pm SoHyCal Hydrogen Valley - Pedro Pajares, H2B2 Electrolysis Technologies, S.L. 1:45 pm Microshelters - Amir Tabakh, Chief of Energy Efficiency at Los Angeles Department of Water and Power 2:15 pm Home Energy Management/DR - Jeff Gill, Schneider Electric 2:45 pm Concluding Remarks  

Strategic Directions for Electronics Packaging Subramanian S. Iyer, Distinguished Professor  UCLA Samueli School of Engineering and Center for Heterogeneous Integration and Performance Scaling   Tuesday, February 4, 2025  3:30 – 5:00 p.m.  UC Irvine CALIT2 Building Auditorium  Abstract: Recent advances in electronics packaging have come to the rescue as CMOS scaling has stalled making possible the incredible advances in artificial intelligence and machine learning that promise to  transform our lives. This journey, however, has only just begun and much more is yet to come. The key features  that will drive this transformation can be described with the simple strategy of “scale-down and scale-out” that  has characterized monolithic CMOS scaling for several decades, the drive to chiplets with higher yields, and the  ability to assemble a diversity of technologies on the same substrate allowing us to blur the lines between  monolithic chip and a large heterogeneous assembly of chips. While we have made progress towards this goal,  the technologies we have developed have ridden on legacy packaging technologies making such systems  incredibly complex and expensive to build. In this talk we will describe our approach to simplify packaging at all  levels: from design, architecture, process and manufacturing that have the potential to take packaging to the  next level including the ability to scale packaging systematically. There are many challenges in this approach. In  this talk we will outline these challenges and show that the adoption of silicon-like technology, new cooling  and power delivery approaches as well as design enablement will propel packaging into the next dimension.  Bio: Subramanian S. Iyer (Subu) is a Distinguished Professor and holds the Charles P. Reames Endowed Chair in  the Electrical Engineering Department and a joint appointment in the Materials Science and Engineering  Department at UCLA. Till recently, he was on assignment to the U.S. Department of Commerce as Director of  the National Advanced Packaging Manufacturing Program, where he laid the foundational strategy for the  national packaging imperative. He is the founding Director of the UCLA Center for Heterogeneous Integration  and Performance Scaling. Prior to that he was an IBM Fellow. His key technical contributions have been the  development of the world’s first SiGe base HBT, Salicide, electrical fuses, embedded DRAM and 45nm  technology node used to make the first generation of truly low power portable devices as well as the first  commercial interposer and 3D integrated products. Since joining UCLA, he has been exploring new packaging  paradigms and device innovations that may enable wafer-scale architectures, in-memory analog compute and  medical engineering applications. He is a fellow of IEEE, APS, iMAPS and NAI as well as a Distinguished Lecturer  of IEEE EDS and EPS. He is a Distinguished Alumnus of IIT Bombay and received the IEEE Daniel Noble Medal  for emerging technologies in 2012 and the 2020 iMAPS Daniel C. Hughes Jr Memorial award and the iMAPS  distinguished educator award in 2021.

Workshop on Quantum Information and Computing Innovations Date: November 14, 2024 Time: 9:00 AM - 5:00 PM Location: Calit2 Auditorium, UC Irvine Please REGISTER Here 9:00 AM - 9:15 AM: Welcome and Opening Remarks from Calit2 Directors Speakers: G.P. Li, Ramesh Rao, Shane Cybart 9:15 AM - 9:45 AM: Plenary 1: "Overview of Quantum Information and Computing Advancements" Speaker: Peter Burke, PhD, University of California Irvine 9:45 AM - 10:15 AM: Plenary 2: "Quantum Materials/Devices" Speaker: Julio Barreiro, PhD, University of California San Diego 10:15 AM - 10:30 AM: Coffee Break 10:30 AM - 11:00 AM: Plenary 3: "Algorithms for Quantum Simulations" Speaker: Sandy Irani, PhD, University of California Irvine 11:00 AM - 11:30 AM: Plenary 4: "RF/MMIC for Quantum Computing" Speaker: Alan Salari, PhD, Quaxys LLC 11:30 AM - 12:30 PM: Networking Lunch 12:30 PM - 2:10 PM: Brainstorming Sessions A series of rapid-fire presentations, each lasting 25 minutes with multiple short presentations (organized by Co-hosts), designed to convey key ideas and inspire new thinking. - State-of-the-Art Facility for Quantum Research Co-hosts: Shane Cybart, PhD, University of California Riverside (low temperature Quantum Computer Cooling - Dilution Refrigerator) - Quantum Computing Infrastructure Needs for Research and Education Co-host: Shan-Wen Tsai, PhD, University of California Riverside - Quantum Sensing Co-host: Javier Sanchez, PhD, University of California Irvine - Quantum Communication Co-Host: Maxim Radikovich Shcherbakov, PhD, University of California Irvine 2:10 PM - 3:10 PM: Exploring New Collaborations: "Quantum Computing and AI (NSF Quantum Leap Challenge Institutes (QLCI)?)" Co-hosts: Yufei Ding, PhD, University of California San Diego 3:10 PM - 5:00 PM: Open House and Student poster session, showcasing: 1. Facilities: - Integrated Nanosystems Research Facility (INRF): world-class clean room devoted to research and development for integrated systems at micro- and nano-size scales Host: Chuangyuan (CY) Lee, PhD, University of California Irvine - Irvine Materials Research Institute (IMRI): Experience state-of-the-art facilities for nanoscale research and development. Host: Jian-Guo Zheng, PhD, University of California Irvine 2. Student Poster Session: Highlighting innovative research and projects developed by students in various fields related to quantum Information and Computing. Who Should Attend:IT/Telecom professionals, researchers and academics, quantum computing service providers, entrepreneurs.