Strategic Directions for Electronics Packaging Subramanian S. Iyer, Distinguished Professor  UCLA Samueli School of Engineering and Center for Heterogeneous Integration and Performance Scaling   Tuesday, February 4, 2025  3:30 – 5:00 p.m.  UC Irvine CALIT2 Building Auditorium  Abstract: Recent advances in electronics packaging have come to the rescue as CMOS scaling has stalled making possible the incredible advances in artificial intelligence and machine learning that promise to  transform our lives. This journey, however, has only just begun and much more is yet to come. The key features  that will drive this transformation can be described with the simple strategy of “scale-down and scale-out” that  has characterized monolithic CMOS scaling for several decades, the drive to chiplets with higher yields, and the  ability to assemble a diversity of technologies on the same substrate allowing us to blur the lines between  monolithic chip and a large heterogeneous assembly of chips. While we have made progress towards this goal,  the technologies we have developed have ridden on legacy packaging technologies making such systems  incredibly complex and expensive to build. In this talk we will describe our approach to simplify packaging at all  levels: from design, architecture, process and manufacturing that have the potential to take packaging to the  next level including the ability to scale packaging systematically. There are many challenges in this approach. In  this talk we will outline these challenges and show that the adoption of silicon-like technology, new cooling  and power delivery approaches as well as design enablement will propel packaging into the next dimension.  Bio: Subramanian S. Iyer (Subu) is a Distinguished Professor and holds the Charles P. Reames Endowed Chair in  the Electrical Engineering Department and a joint appointment in the Materials Science and Engineering  Department at UCLA. Till recently, he was on assignment to the U.S. Department of Commerce as Director of  the National Advanced Packaging Manufacturing Program, where he laid the foundational strategy for the  national packaging imperative. He is the founding Director of the UCLA Center for Heterogeneous Integration  and Performance Scaling. Prior to that he was an IBM Fellow. His key technical contributions have been the  development of the world’s first SiGe base HBT, Salicide, electrical fuses, embedded DRAM and 45nm  technology node used to make the first generation of truly low power portable devices as well as the first  commercial interposer and 3D integrated products. Since joining UCLA, he has been exploring new packaging  paradigms and device innovations that may enable wafer-scale architectures, in-memory analog compute and  medical engineering applications. He is a fellow of IEEE, APS, iMAPS and NAI as well as a Distinguished Lecturer  of IEEE EDS and EPS. He is a Distinguished Alumnus of IIT Bombay and received the IEEE Daniel Noble Medal  for emerging technologies in 2012 and the 2020 iMAPS Daniel C. Hughes Jr Memorial award and the iMAPS  distinguished educator award in 2021.

REGISTER AGENDA 10:00 am Welcome - Professor GP Li, director Calit2/CalPlug/ITAC 10:10 am From Barriers to Breakthroughs: Social Science Insights for Accelerating Heat Pump Adoption in California - Sarah Outcault, Market Transformation Research Director at the UC Davis Energy and Efficiency Institute and Western Cooling Efficiency Center 10:40 am CalPlug and SMART IAC Updates Arnold Wang – CalPlug Katie Gladych – Energy Plug Load updates/CA EE Policy Chelsea Choudhary – SMART ITAC Noon Lunch Break 12:45 pm Realizing the Potential of Clean Hydrogen - Jeff Reed, Renewable Fuels and Energy Storage Chief Scientist at UC Irvine Advanced Power and Energy Program 1:15 pm SoHyCal Hydrogen Valley - Pedro Pajares, H2B2 Electrolysis Technologies, S.L. 1:45 pm Microshelters - Amir Tabakh, Chief of Energy Efficiency at Los Angeles Department of Water and Power 2:15 pm Home Energy Management/DR - Jeff Gill, Schneider Electric 2:45 pm Concluding Remarks  

Min-Fu Hsieh Professor Department of Electrical Engineering National Cheng Kung University, Taiwan Abstract: The impact of artificial intelligence (AI) is rapidly growing and is increasingly pivotal across a wide range of disciplines, from innovative scientific research to practical, everyday applications. The powerful capabilities of AI—spanning data analysis, predictive modeling, and beyond—equip researchers and professionals with unparalleled tools to tackle complex problems, push the boundaries of scientific discovery, and elevate productivity to unprecedented levels. This talk will explore the integration of AI in diagnosing motor faults and advancing motor design, highlighting how AI can significantly enhance the reliability and performance of electric motors in green transportation. It will delve into the use of machine learning and deep learning models to predict and prevent motor failures (e.g., inter-turn short-circuits, demagnetization, and bearing faults), which is essential for ensuring safety and reliability in transportation and industry. Furthermore, the talk will highlight AI-driven innovations in motor design, such as noise-reduction, offering insights into how AI can revolutionize traditional motor systems and contribute to ongoing improvements in predictive maintenance and design practices. Bio: Min-Fu Hsieh received his B.Eng. degree in Mechanical Engineering from National Cheng Kung University (NCKU), Tainan, Taiwan, in 1991, and his M.Sc. and Ph.D. degrees in Mechanical Engineering from the University of Liverpool, U.K., in 1996 and 2000, respectively. From 2000 to 2003, he served as a researcher at the Electric Motor Technology Research Center, NCKU. He joined the Department of Systems and Naval Mechatronic Engineering at NCKU as an Assistant Professor in 2003 and was promoted to Full Professor in 2012. In 2017, he moved to the Department of Electrical Engineering at NCKU, where he has been a Distinguished Professor since 2022. His research interests include electric machine design, motor drives, and mechatronics. Prof. Hsieh currently serves as an Editor for IEEE Transactions on Magnetics and as an Associate Editor for IEEE Transactions on Industry Applications. He is also a Distinguished Lecturer of the IEEE Magnetics Society for 2025–2026. He has held key roles in major international conferences, including serving as Publications Co-Chair for several IEEE INTERMAG conferences and as the Local Organizing Committee Chair for the 2025 IEEE IAS Annual Meeting. He is the recipient of several honors, including the Outstanding Research Award from Taiwan’s National Science and Technology Council. He is a Fellow of the Institution of Engineering and Technology (IET).